Chip Energy and Readout Closure

Thermal Resistance Chain Audit

temperature margin divided by resistance

A chip thermal path is trusted only when temperature margin, thermal resistance, and heat-flow power close in one exact unit ledger. Exact arithmetic here means exact results for the stated model inputs; measured inputs still carry uncertainty and significant-figure limits.

highlighted = computed this step

Thermal resistance turns temperature margin into heat-flow power

The chip path is still a lumped training model. It does not claim a full temperature map; it only checks one temperature difference against one thermal resistance.

P=ΔTRthP=\frac{\Delta T}{R_{\text{th}}}
Thermal resistanceA lumped thermal path maps temperature difference to power.temperaturepowerthermal path

Three thermal paths close by division

Each row divides temperature difference by thermal resistance. The units close because kelvin divided by kelvin per watt leaves watts.

ΔTRthP30 K5 K/W6 W40 K8 K/W5 W20 K4 K/W5 W\begin{array}{c|c|c}\Delta T&R_{\text{th}}&P\\30\ \text{K}&5\ \text{K/W}&6\ \text{W}\\40\ \text{K}&8\ \text{K/W}&5\ \text{W}\\20\ \text{K}&4\ \text{K/W}&5\ \text{W}\\\end{array}
Thermal resistanceA lumped thermal path maps temperature difference to power.temperaturepowerthermal path

The rendered row cites the same thermal ledger

For the rendered row, the temperature difference is 40 K and thermal resistance is 8 K/W, so the heat-flow power is 5 W.

40 K/8 K/W=5 W40\ \text{K}/8\ \text{K/W}=5\ \text{W}
Thermal resistanceA lumped thermal path maps temperature difference to power.temperaturepowerthermal path

The same power can come from different margins

The last two rows both close to the same heat-flow power even though their temperature differences and thermal resistances are different. That is why the ledger needs both columns.

40 K/8 K/W=5 W,20 K/4 K/W=5 W40\ \text{K}/8\ \text{K/W}=5\ \text{W},\quad 20\ \text{K}/4\ \text{K/W}=5\ \text{W}
Thermal resistanceA lumped thermal path maps temperature difference to power.temperaturepowerthermal path

Thermal closure rejects a unitless heat claim

The audit keeps temperature margin, thermal resistance, and power in one unit ledger. A chip heat-flow number is trusted only after that ledger closes.

K/(K/W)=WK/(K/W)=W
Thermal resistanceA lumped thermal path maps temperature difference to power.temperaturepowerthermal path